Near-threshold operations provide a powerful knob for improving energy efficiency and alleviating on-chip power densities. This article explores the impact of newest FinFET CMOS technologies (from 40 to 7 nm) on near-threshold computing in terms of …
Supply-voltage scaling has stagnated in recent technology nodes, leading to so-called dark silicon. To increase overall chip multiprocessor (CMP) performance, it is necessary to improve the energy efficiency of individual tasks so that more tasks can …
We present ultra low power silicon photonic transceivers, including a 320 fJ/bit reverse biased ring modulator integrated with CMOS driver, and a 690 fJ/bit record-low power receiver with sensitivity of -18.9 dBm at 5 Gbps for bit-error-rate of …
Flexible, stress-engineered spring interconnects are a novel technology potentially enabling room temperature assembly approaches to building highly integrated and multi-chip modules (MCMs). Such interconnects are an essential solder-free technology …
Recent advances in silicon photonics bring significant benefits to "macrochip" grids made of arrayed chips. Such configurations have global interconnects long enough to benefit from the high speed, low energy, and high bandwidth density of optics. In …
We report the first 400fJ/bit all-CMOS silicon photonic transmitter made of CMOS depletion ring modulator flip-chip integrated with CMOS driver, and demonstrated error-free 5Gbps transmission of over 1.5Pbits of data without closed-loop ring …